Name: Model EAC
Availability: InStock

Model EAC

Category: Semiconductor Manufacturing Equipment

Quantity:

EBARA Semiconductor Manufacturing Equipment

EBARA Electroplating System

Semiconductor Wafers Rewiring

Model F-REX

Fixed abrasive for excellent polish/removal performance, edge control function

Outstanding polish/removal performance using fixed abrasive
Device surface contact-free concept
Bevel profile control capability
Wide/flexible polishing area coverage
SEMI-S2/CE available

Features and Benefits

Model EAC is a bevel polishing system that removes defects and unneeded membranes by polishing the bevels on the edge of semiconductor wafers as well as the top edge and backside edge. Fixed abrasive allows for physical polishing without selection of polish target. Recipe-controllable polishing heads also enable high-precision control of the wafer edge shape.

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