High performance, high throughput for high productivity
- Dry-in/Dry-out
- High process performance
- High throughput capability
- High operating rates
- Multi step chemical cleaning capability
- Polishing process end point monitor (option)
- In-line film thickness monitor (option)
- Diverse functions and flexible configuration
- SEMI-S2/CE available
Features and Benefits
Model F-REX is a clean room-compatible CMP system for chemical mechanical polishing of wafer surfaces. Its high reliability and outstanding process performance have been demonstrated in the market, and it offers diverse and flexible configurations to meet every customer’s needs.
Dual-module system with no mutual contamination between process chambers. If one module stops, the other module start the operation automatically. This means that there is no need to shut down the entire unit for maintenance or trouble shooting, enabling high productivity. The dual-module system also facilitates multiple process treatment in one unit. Unit configurations that are ideal not only for mass production but also for testing and development are available.
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