EBARA Semiconductor Manufacturing Equipment

Combustion-type exhaust abatement system with low NOx emissions and abundant reaction byproduct measures for reduced maintenance costs.

Dry abatement system for treatment of hazardous substances such as arsenic and phosphorous without need for water scrubbing

• Best suited for research facilities
• Adsorbs specific chemical substances

Highly efficient, energy-saving catalysis-type exhaust abatement system

• Catalysis-type exhaust abatement system
• Low power consumption
• Highly efficient abatement of PFC gases
• No fuel required
• Low maintenance costs

Combustion-type exhaust abatement system capable of simultaneous abatement of large volumes of hydrogen and chlorine gas

• Combustion-type exhaust abatement systems
• Treat large volumes of chlorine gas and hydrogen gas simultaneously
• Batch treatment of multiple gas types
• Highly efficient abatement of PFCs
• Byproduct removal

Combustion-type exhaust abatement system that offers highly efficient treatment of flammable gases and perfluorocarbons (PFCs)

• Combustion-type exhaust abatement systems
• Batch treatment of multiple gas types
• Highly efficient abatement of PFCs
• Byproduct removal measures/automatic removal of powdery byproducts
• Low running

Dry exhaust abatement system for highly efficient and safe treatment of PFC gases with no need for water scrubbing

• Dry exhaust abatement system
• Low power consumption
• Highly efficient abatement of PFC gases
• Solidification of fluorine series gases
• No water scrubbing required
• No fuel required

Achieves both high-throughput, high-speed plating and superior uniformity performance

• High throughput capability
• Superior uniformity performance
• Suitable for plating on diverse substrates and thin seed layers
• Suitable for a variety of applications
• Flexible platform configuration

Further improvement of production efficiency, high-performance & flexible CMP system

• Dry-in/Dry-out
• Excellent process performance
• Reliable structure (one table-one head, dual module system)
• High operation rate/High throughput
• Suitable for multi-stage chemical cleaning
• Detection monitor at polishing endpoint

High performance, high throughput for high productivity

• Dry-in/Dry-out
• High process performance
• High throughput capability
• High operating rates
• Multi step chemical cleaning capability
• Polishing process end point monitor (option)
• In-line film thickness monitor (option)
• Diverse functions and

Fixed abrasive for excellent polish/removal performance, edge control function

• Outstanding polish/removal performance using fixed abrasive
• Device surface contact-free concept
• Bevel profile control capability
• Wide/flexible polishing area coverage
• SEMI-S2/CE available