EBARA Electroplating System, EBARA Semiconductor Manufacturing Equipment
Achieves both high-throughput, high-speed plating and superior uniformity performance
- High throughput capability
- Superior uniformity performance
- Suitable for plating on diverse substrates and thin seed layers
- Suitable for a variety of applications
- Flexible platform configuration
Features and Benefits
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High performance, high throughput for high productivity
- Dry-in/Dry-out
- High process performance
- High throughput capability
- High operating rates
- Multi step chemical cleaning capability
- Polishing process end point monitor (option)
- In-line film thickness monitor (option)
- Diverse functions and
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Fixed abrasive for excellent polish/removal performance, edge control function
- Outstanding polish/removal performance using fixed abrasive
- Device surface contact-free concept
- Bevel profile control capability
- Wide/flexible polishing area coverage
- SEMI-S2/CE available
Features and Benefits
Model
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